| Paket Perangkat pemasok: | 676-FBGA (27x27) |
|---|---|
| Kecepatan: | 166MHz |
| Seri: | SmartFusion®2 |
| Atribut utama: | FPGA - 60K Logic Modules |
| Peripherals: | DDR, PCIe, SERDES |
| Pengemasan: | Tray |
| Paket / Case: | 676-BGA |
| Suhu Operasional: | 0°C ~ 85°C (TJ) |
| Jumlah I / O: | 387 |
| MCU RAM: | 64KB |
| MCU flash: | 256KB |
| core Processor: | ARM® Cortex®-M3 |
| konektivitas: | CAN, Ethernet, I²C, SPI, UART/USART, USB |
| Arsitektur: | MCU, FPGA |
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