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Permintaan Penawaran
tegangan Penilaian: | - |
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Penghentian: | Solder |
Gaya: | Board to Board |
Seri: | CLE |
Row Spacing - Mating: | 0.047" (1.20mm) |
Pitch - Kawin: | 0.031" (0.80mm) |
Pengemasan: | Bulk |
Suhu Operasional: | -55°C ~ 125°C |
Jumlah baris: | 2 |
Jumlah Posisi Loaded: | All |
Jumlah Posisi: | 80 |
mount Jenis: | Surface Mount |
Bahan mudah terbakar Penilaian: | UL94 V-0 |
Kawin Stacking Heights: | - |
Diferensial Transmisi Data: | Liquid Crystal Polymer (LCP) |
Isolasi Tinggi: | 0.130" (3.30mm) |
Warna Isolasi: | Black |
Perlindungan ingress: | - |
fitur: | Pick and Place |
pengikatan Jenis: | Push-Pull |
Peringkat saat ini: | 2.7A per Contact |
Hubungi Type: | Female Socket |
Formulir kontak: | Square |
kontak Material: | Beryllium Copper |
Panjang Kontak - Pos: | - |
Hubungi Finish Tebal - Pos: | 10µin (0.25µm) |
Hubungi Finish Thickness - Mating: | 10µin (0.25µm) |
Hubungi Selesai - Pos: | Gold |
Hubungi Finish - Mating: | Gold |
Jenis konektor: | Receptacle, Pass Through |
Aplikasi: | - |